Stripping device and stripping method

ABSTRACT

A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/093,412, filed Apr. 25, 2011, which claims priority under 35 U.S.C.§119(a)-(d) to Japanese Patent Applications Numbers 2010-102066 and2010-102081, both filed on Apr. 27, 2010, the entire contents of whichare incorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a stripping device and a strippingmethod for stripping a supporting plate from a substrate to which thesupporting plate is adhered.

BACKGROUND OF THE INVENTION

As devices such as mobile phone, digital AV apparatuses, IC cards etc.have been improved to have higher performance, semiconductor siliconchips (hereinafter, refer to as chips) to be mounted on the devices haveto be smaller and thinner in order to greatly increase a number of chipsmounted in packages of the devices. To greatly increase a number ofchips mounted in the package, the chips should have a thin thickness ina range of 25 to 150 μm.

However, semiconductor wafers (hereinafter, refer to as wafers) to besubstrates of the chips is weakened in strength when the wafers arepolished to a thin thickness. The thin wafers with weak strength areeasy to be cracked or curved. Moreover, the thin wafers with weakstrength are difficult to transport by automatic transportation. Thisrequires manual transportation, and thereby tedious handling.

To deal with this problem, a wafer support system has been developed toreinforce the strength of the wafers by adhering a plate (called asupporting plate, and generally made from glass or rigid plastic) to thewafers before polishing. The wafer support system prevents cracking andcurving of the wafer. The wafer support system, which reinforces thestrength of the wafers, allows automatic transportation of the thinsemiconductor wafers.

The wafers and supports are adhered with each other via an adhesivetape, thermoplastic resin, an adhesive, or the like. After a waferadhered with the supporting plate is thinned, the wafer is stripped offfrom the supporting plate before dicing. For example, in case where thewafer and the supporting plate are adhered with each other via anadhesive, the adhesive is dissolved so as to strip the wafer off fromthe supporting plate.

Patent Literature 1 discloses one example of such a technique ofstripping a support plate from a wafer. In the technique of PatentLiterature 1, the dissolving an adhesive layer for adhering a wafer anda support plate having holes is carried out by soaking into a solventthe support plate having holes, so as to deliver the solvent to theadhesive layer via the holes. Patent literature 1 also discloses thatthe dissolving the adhesive agent adhering the wafer and the supportplate is carried out by supplying the solvent onto a surface of thesupport plate and vibrating the solvent so as to facilitate thedissolving the adhesive agent with the solvent. Moreover, PatentLiterature 2 discloses that a solvent is supplied onto a support platehaving holes and the solvent is delivered to the adhesive layer via theholes.

CITATION LIST Patent Literatures

Patent Literature 1

-   Japanese Patent Application Publication, Tokukai, No. 2001-185519    (Publication Date 2001, July 6)

Patent Literature 1

-   Japanese Patent Application Publication, Tokukai, No. 2008-177412    (Publication Date 2008, July 31)

SUMMARY OF THE INVENTION Technical Problem

The conventional art as disclosed in Patent Literature 1 requires use ofa jig at a wafer edge portion of the wafer in order to prevent a dicingtape (adhered on the wafer) or the like from being contaminated with thesolvent, so that the jig presents the leakage of the solvent. Thepresence of the jig lowers solubility of the adhesive layer, especially,at the wafer edge section. Moreover, in the techniques as disclosed inPatent Literatures 1 and 2, the solvent is supplied to the adhesivelayer via the holes of the support plate. Therefore, the solubility ofthe adhesive layer is lower especially at an edge portion of the supportplate in which no hole is formed, than the other parts of the supportplate. As a result, the stripping of the support plate from the wafer istime-consuming.

If the adhesive still remains partially on the wafer, the stripping ofthe wafer off from the support plate should be carried out after theadhesive still remained partially on the wafer is dissolved. In thetechniques as disclosed in Patent Literatures 1 and 2, the solvent issupplied to the adhesive layer via the holes of the support plate.Therefore, the solubility of the adhesive layer is lower especially atan edge portion of the support plate in which no hole is formed, thanthe other parts of the support plate. Moreover, the technique disclosedin Patent Literature 2 has such a problem that the vibration istransmitted unevenly, thereby causing incomplete dissolving. If theadhesive agent can be dissolved more evenly, it will lead to such anadvantage that it is possible to strip the support plate from the waferin a shorter time.

The present invention was accomplished in view of the aforementionedproblem and an object of the present invention is to provide a strippingmethod and a stripping device capable of striping a support plate fromthe wafer in a shorter time.

Solution to Problem

In order to attain the object, a first stripping method according to thepresent invention is a stripping method for stripping a support platefrom a laminate including a substrate and the support plate adhered tothe wafer via an adhesive layer, wherein: the adhesive layer is formedfrom an adhesive compound soluble in a non-polar solvent or an adhesivecompound soluble in a highly polar solvent; and the stripping methodcomprises the step of supplying the non-polar solvent or the highlypolar solvent, so that the non-polar solvent or the highly polar solventis retained at least on an edge portion of that surface of the laminatewhich surface faces the support plate, and on a lateral surface of thelaminate.

Moreover, a first stripping device according to the present invention isa stripping device for stripping a support plate from a laminateincluding a substrate and the support plate adhered to the wafer via anadhesive layer, wherein: the adhesive layer is formed from an adhesivecompound soluble in a non-polar solvent or an adhesive compound solublein a highly polar solvent; and the stripping device comprises retainingmeans for containing the laminate inside thereof in which the non-polarsolvent or the highly polar solvent is retained.

Moreover, a second stripping device according to the present inventionis a stripping device for stripping a support plate from a laminateincluding a substrate and the support plate adhered to the substrate viaan adhesive layer, the stripping device comprising: retaining means forretaining on the laminate a solvent for dissolving the adhesive layer;at least one vibrating section for generating vibration to vibrate atleast the solvent; and moving means for moving the at least onevibrating section relatively to the laminate.

Moreover, a second stripping method according to the present inventionis a stripping method for stripping a support plate from a laminateincluding a substrate and the support plate adhered to the substrate viaan adhesive layer, the stripping method comprising the steps of:supplying on the laminate a solvent for dissolving the adhesive layer,so that the solvent is retained on the laminate; vibrating, by avibrating section, at least the solvent retained on the laminate; andmoving the vibrating section relatively to the laminate.

Advantageous Effects of the Invention

The first stripping method according to the present invention is astripping method for stripping a support plate from a laminate includinga substrate and the support plate adhered to the wafer via an adhesivelayer, wherein: the adhesive layer is formed from an adhesive compoundsoluble in a non-polar solvent or an adhesive compound soluble in ahighly polar solvent; and the stripping method comprises the step ofsupplying the non-polar solvent or the highly polar solvent, so that thenon-polar solvent or the highly polar solvent is retained at least on anedge portion of that surface of the laminate which surface faces thesupport plate, and on a lateral surface of the laminate. With thisconfiguration, the present invention makes it possible to easily stripthe support plate from the wafer in a short time.

Moreover, the second stripping device according to the present inventionis a stripping device for stripping a support plate from a laminateincluding a substrate and the support plate adhered to the substrate viaan adhesive layer, the stripping device comprising: retaining means forretaining on the laminate a solvent for dissolving the adhesive layer;at least one vibrating section for generating vibration to vibrate atleast the solvent; and moving means for moving the at least onevibrating section relatively to the laminate. With this configuration,the present invention makes it possible to easily strip the supportplate from the wafer in a shorter time.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view schematically illustrating a strippingdevice according to one embodiment (first embodiment) of a firststripping device of the present invention.

FIGS. 2( a)-(f) are views schematically illustrating a stripping methodaccording to one embodiment (first embodiment) of a first strippingmethod of the present invention.

FIG. 3 is a cross sectional view schematically illustrating a strippingdevice according to another embodiment (second embodiment) of the firststripping device of the present invention.

FIG. 4 is a cross sectional view schematically illustrating thestripping device according to the another embodiment (second embodiment)of the first stripping device of the present invention.

FIG. 5 is a cross sectional view schematically illustrating a strippingdevice according to one embodiment (third embodiment) of the secondstripping device of the present invention.

FIGS. 6( a)-(f) are views schematically illustrating a stripping methodaccording to one embodiment (third embodiment) of the second strippingmethod of the present invention.

FIG. 7 is a cross sectional view schematically illustrating to astripping device according to yet another embodiment (fourth embodiment)of the second stripping device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

(Striping Device 10)

One embodiment of a first stripping method and a first stripping deviceaccording to the present invention is described below referring toFIG. 1. FIG. 1 is a cross sectional view schematically illustrating astripping device according to one embodiment (first embodiment) of afirst stripping device of the present invention. A striping device 10 isa device for stripping a support plate 3 from a laminate 1 including awafer (substrate) 2 and the support plate (support board) 3 adhered tothe wafer 2 via an adhesive layer 4, which is a layer of an adhesiveagent. The stripping device 10 includes a solvent supplying chamber(retaining means) 11 for forming a retaining section 12 in cooperationwith a dicing tape 5 adhered to a wafer-2-side surface of the laminate1. The retaining section 12 is for holding a solvent therein and isformed by causing the solvent supplying chamber 11 to touch the dicingtape 5. The dicing tape 5 is held by a dicing frame 6.

The solvent supplying chamber 11 is configured to contain the laminate 1in an inside of the solvent supplying chamber 11, that is, the retainingsection 12 of the solvent supplying chamber 11. The retaining section 12is constituted by a space formed between the solvent supplying chamber11 and the dicing tape 5 when the solvent supplying chamber 11 is causedto touch the dicing tape 5. The solvent supplying chamber 11 has asupplying opening 14 for supplying the solvent to the retaining section12, and discharge openings 15 and 16 for discharging the solvent out ofthe retaining section 12. As one alternative, the solvent supplyingchamber 14 may be configured such that the solvent is supplied from theopenings 15 and 16 and discharged from the opening 14. A boundary wherethe solvent supplying chamber 11 and the dicing tape 5 is in contact issealed with an O ring 13, so that the solvent supplied to the retainingsection 12 will not leak out of the retaining section 12. Moreover, theleakage of the solvent out of the retaining section 12 may be preventedby, instead of using the O ring 13, for example, retaining the solventinside the retaining section 12 by surface tension of the solventbetween the solvent supplying chamber 11 and the dicing tape 5. What isrequired is that the retaining section 12 allows the solvent to be keptinside the retaining section 12 for a certain period of time so that thesolvent can permeate into the laminate 1. For example, the retainingsection 12 may be so configured to make a flow of the solvent in theretaining section 12 from the supplying opening 14 to the dischargeopenings 15 and 16.

The solvent supplying chamber 11 is so configured that the retainingsection 12 constituted by the solvent supplying chamber 11 and thedicing tape 5 has an outer diameter larger than an outer diameter of thelaminate 1. With this configuration, the solvent supplying chamber 11can contain the laminate 1 within the retaining section 12 by covering asupport-plate-3-side surface of the laminate 1 and lateral surface ofthe laminate 1. The retaining section 12 may or may not have a shapecorresponding to a shape of the laminate 1. The retaining section mayhave any shape provided that the retaining section 12 can contain thelaminate 1 inside thereof. For example, for a laminate 1 having acircular shape on its support-plate-3-side surface, the solventsupplying chamber 11 may or may not have a circular shape on a surfacethereof facing the support plate 3, provided that the solvent supplyingchamber 11 can contain the laminate 1 inside thereof.

The supplying opening 14 is provided at or near a center of the solventsupplying chamber 11. The solvent supplied via the supplying opening 14at or near the center of the solvent supplying chamber 11 is retained inthe retaining section 12 and then discharged out of the two dischargingopenings 15 and 16 of the solvent supplying chamber 11. The dischargingopenings 15 and 16 are provided on lateral side of the solvent supplyingchamber 11. Therefore, the solvent is collected by being discharged fromthe lateral side of the laminate 1 after being retained inside of thesolvent supplying chamber 11. The supplying opening 14 is a through holeof the solvent supplying chamber 11 and is opened on a laminate-1 sideof the solvent supplying chamber 11. The discharge openings 15 and 16are through holes of the solvent supplying chamber 11 and are opened onthe laminate-1 side and lateral side of the solvent supplying chamber11. The discharge openings 15 and 16 are connected with pressurereducing means (not illustrated) such as a vacuum pump, so that thesolvent is discharged by applying reduced pressure on the dischargeopenings 15 and 16.

The adhesive layer 4 is formed from an adhesive compound soluble in anon-polar solvent or a highly polar solvent. Therefore, the solventsupplying chamber 11 supplies a non-polar solvent or a highly polarsolvent as the solvent for dissolving the adhesive layer 4. That is, ifthe adhesive layer 4 is formed from an adhesive compound soluble in anon-polar solvent, the solvent supplying chamber 11 supplies thenon-polar solvent as the solvent for dissolving the adhesive layer 4.Meanwhile, if the adhesive layer 4 is formed from an adhesive compoundsoluble in a highly polar solvent, the solvent supplying chamber 11supplies the highly polar solvent as the solvent for dissolving theadhesive layer 4. Examples of the non-polar solvent and the highly polarsolvent suitably usable as the solvent for dissolving the adhesive layer4 will be given later.

Because the stripping device 10 is so arranged that the solvent fordissolving the adhesive layer 4 is a non-polar solvent or a highly polarsolvent, the dicing tape 5 will not be damaged by the solvent even ifthe solvent touches the dicing tape 5. In general, an adhesive layer ofthe dicing tape 5 is formed from an acrylic adhesive agent, whereby theadhesive layer of the dicing tape 5 is tolerant against non-polarsolvents and highly polar solvents. Therefore, without worrying aboutthe consequences of the solvent touching the dicing tape 5, it ispossible to supply the solvent so as to retain the solvent inside of theretaining section 12 in which the laminate 1 is contained, and then tocover the support-plate-3-side surface and lateral surface of thelaminate 1 with the solvent.

Because the dicing tape 5 is damaged if the solvent touches the dicingtape 5, the conventional stripping device requires an O-ring so as tosupply the solvent to the supply plate 3 but not to the dicing tape 5 indissolving the adhesive layer. The O-ring seals the boundary where thesolvent supplying chamber and the support plate 3 contact with eachother. Because of this, it takes a long time to supply the solvent to anedge portion at which the support plate 3 has no hole. As a result, thestripping of the support plate 3 from the wafer 2 takes a long time.

With the stripping device 10 according to the present embodiment, theretaining section 12 is configured such that the solvent will beretained on the support-plate-3-side surface and lateral surface of thelaminate 1. As a result, the solvent permeates into the laminate 1 via athrough hole of the support plate 3 and reaches the adhesive layer 4.Further, the solvent permeates into the laminate 1 from the lateral sideof the laminate 1 so as to reach the adhesive layer. Thus, a sufficientamount of the solvent permeates to the adhesive layer 4 in the edgeportion in which the support plate 3 has no hole. As a result, theadhesive layer 4 can be efficiently dissolved at the edge portion aswell. This makes it possible to strip the support plate 3 from the waferin a shorter time.

(Laminate 1)

The laminate 1 is so configured that the wafer 2 and the support plate 3are adhered with each other via the adhesive layer 4. In the presentembodiment, the support plate 3 is a holed support plate 3 having aplurality of through holes in a thickness direction thereof. The use ofthe holed support plate 3 makes it possible to supply the solvent to theadhesive layer 4 via the though holes. The wafer 2 of the laminate 1 mayor may not have a circular shape and may have a non-circular shapepartially having an orientation flat. The support plate 3 can have anyshape that can support the wafer 2. However, it is preferable that thesupport plate 3 has a shape corresponding to that of the wafer 2.

(Adhesive Layer 4)

The adhesive layer 4 is formed from an adhesive compound soluble in anon-polar solvent or a highly polar solvent. Therefore, the adhesivelayer 4 is soluble with the non-polar solvent or the highly polarsolvent, thereby allowing stripping the support plate 3 from the wafer2.

Examples of the adhesive compound soluble in a non-polar solventencompass hydrocarbon resins. Examples of the hydrocarbon resinencompass, but not limited to, resins having a constituent unit derivedfrom cycloolefin, terpene-based resins, and the like. Moreover, onenon-limiting example of the resins having a constituent unit derivedfrom cycloolefin is a cycloolefin-based polymer (hereinafter may bereferred to as a “resin A”).

The resin A is a resin prepared by polymerizing a monomer componentincluding a cycloolefin-based monomer (a1). More specifically, the resinA may be a open-ring (co)polymer of the monomer component including thecycloolefin-based monomer (a1), a resin prepared by addition(co)polymerization of the monomer component including thecycloolefin-based monomer (a1), and the like polymer.

Examples of the cycloolefin-based monomer (a1) contained in the monomercomponent constituting the resin (A) encompass: two-ring compounds suchas norbornene and norbornadiene; three-ring compounds such asdicyclopentadiene and dihydroxypentadiene; four-ring compounds such astetracyclododecene; five-ring compounds such as cyclopentadiene trimer;seven-ring compounds such as tetracyclopentadiene; these polycycliccompounds substituted with an alkyl (methyl, ethyl, propyl, butyl, etc.)group, with an alkenyl (vinyl etc.) group, with an alkylidene(ethylidene etc.) group, or an aryl (phenyl, tolyl, naphthyl, etc.)group; and the like. Among these, the cycloolefin-based monomer (a1) maybe preferably a norbornene-based monomer being represented by thefollowing general formula (1), and being selected from the groupconsisting of norbornene and tetracyclododecene, which are substitutedor not substituted with an alkyl group.

where R₁ and R₂ are independently a hydrogen or an alkyl group having 1to 5 carbon atoms, and n is 0 or 1. The monomer components from whichthe resin A is produced may include, in addition to thecycloolefin-based monomer (a1), another monomer that is copolymerizablewith the cycloolefin-based monomer (a1). Preferably, the another monomermay be, for example, an alkene monomer (a2) represented by the followinggeneral formula (2). Examples of the alkene monomer (a2) encompassethylene, α-olefin, etc. The alkene monomer (a2) may be straight-chainedor branched.

where R₃ to R₆ are independently a hydrogen or an alkyl group having 1to 5 carbon atoms. It is preferable that 50% or more by mass of themonomer component constituting the resin A is the cycloolefin-basedmonomer (a1). It is more preferable that 60% or more by mass of themonomer component constituting the resin A is the cycloolefin-basedmonomer (a1). When 50% or more by mass of the monomer componentconstituting the resin A is the cycloolefin-based monomer (a1), theadhesive layer 4 has a good adhesive strength under high-temperatureenvironment.

In order to prevent gas generation under high temperature, it ispreferable that the resin (A) is a resin not having a polar group. Oneexample of the resin not having a polar group is a resin prepared bypolymerizing monomer components comprising the cycloolefin-based monomer(a1) represented by Formula (1) and the alkene monomer (a2) representedby Formula (2).

There is no particular limitation as to a polymerization method,polymerization conditions, etc. for the polymerization of the monomercomponent. Thus, the polymerization of the monomer component may becarried out by standard methods known to the art.

Examples of commercially-available resin (A) encompass “TOPAS” (productname, made by Polyplastics Co., Ltd.), “APEL” (product name, made byMitsui Chemicals Inc.), “ZEONOR” and “ZEONEX” (product names, made byZeon Corp.), and “ARTON” (product name, made by JSR corp.), etc.

It is preferable that a glass transition point (Tg) of the resin (A) is60° C. or higher. It is more preferable that the glass transition point(Tg) of the resin (A) is 70° C. or higher. If the glass transition point(Tg) of the resin (A) is 60° C. or higher, it is possible to prevent theadhesive layer from softening that may be caused when the adhesivecomposition is exposed to high-temperature environment.

The terpene-based resin (hereinafter, may be referred to as a “resin(B)” encompass a terpene resin, terpene phenol resin, modified terpeneresin, hydrogenated terpene resin, and hydrogenated terpene phenolresin, and the like. Among these, hydrogenated terpene resin ispreferable.

It is important that the softening point of the resin (B) be in a rangeof 80 to 160° C. If the softening point of the resin (B) is lower than80° C., the adhesive layer will be softened when the adhesivecomposition is exposed to high-temperature environment. Meanwhile, ifthe softening point of the resin (B) is higher than 160° C., thestripping rate for stripping by ungluing the adhesive composition willbe slow.

It is important that the resin (B) have a molecular weight of 300 to3000. If the molecular weight of the resin (B) is less than 300, theadhesive layer will have insufficient heat tolerance, thereby causinggas generation under high-temperature environment. On the other hand, ifthe molecular weight of the resin (B) is greater than 3000, thestripping rate for stripping by ungluing the adhesive composition willbe slow. In the present invention, the molecular weight of the resin (B)is a polystylene-based molecular weight measured by gel permeationchromatography (GPC).

The adhesive compound may include both or one of the resins (A) and (B).If the adhesive compound includes both of the resins (A) and (B), theresin (A) and the resin (B) are in such a ratio that (A):(B)=80:20 to55:45 (by mass). If the resin (A) is contained more than the ratio (inother words, if the resin (B) is contained less than the ratio), thestripping ratio for stripping by ungluing the adhesive composition willbe slow. On the other hand, if the resin (A) is contained less than theratio (in other words, if the resin (B) is contained more than theratio), the adhesive layer will be softened when the adhesivecomposition is exposed to high-temperature environment. The softeningwould cause adhesion failure.

Examples of the adhesive compound soluble in a highly polar solventencompass, but not limited to, collagen peptide, cellulose, polyvinylalcohol (PVA), starch, etc.

The collagen peptide can be generated by hydrolysis of a gelatinprepared by thermally denaturing collagen molecules in such a mannerthat helically-entangled polypeptide chains of the collagen moleculesare partially detangled by thermal denaturing. The collagen moleculesmay be mammalian collagen molecules and fish collagen, preferably. Thecollagen molecules may be commercially available collagen molecules. Thecollagen molecules is preferably such that the collagen peptide preparedfrom the collagen molecule is dissolved into the polar solventpreferably at a dissolving rate of 100 to 300 nm/sec, and especiallypreferably of 200 nm/sec.

The adhesive layer 4 is formed from the adhesive compound soluble in thenon-polar solvent or the highly polar solvent, and may be chosen asappropriate for treatment to which the laminate 1 is to be subjected.For example, if a large amount of water is to be used in a thinningprocess of the wafer 2, it is preferable to use an adhesive layer 4formed from the adhesive compound soluble in the non-polar solvent,because an adhesive compound soluble in the highly polar solvent wouldpossibly be dissolved in the water.

As to a layer thickness of the adhesive layer 4, the adhesive layer 4should have a layer thickness that secures the adhesion between thewafer 2 and the support plate 3, and that provides the adhesive layer 4with heat tolerance. The adhesive layer 4 may be formed by applying theadhesive compound on the wafer 2 or the support plate 3 and solidifyingthe adhesive compound to form a layer of the adhesive compound. As onealternative, a layer of the adhesive compound formed in advance bysolidifying the adhesive compound may be applied to the wafer 2 or thesupport plate 3, so as to form the adhesive layer 4.

(Stripping Method)

A stripping method according to one embodiment of the first strippingmethod of the present invention is a stripping method for stripping thesupport plate 3 from the laminate 1 including the wafer 2 and thesupport plate 3 adhered to the wafer 2 via the adhesive layer 4 formedfrom the adhesive compound soluble in the non-polar solvent or thehighly polar solvent, the method comprising the step of supplying thenon-polar solvent or the highly polar solvent in such a manner that thenon-polar solvent or the highly polar solvent is retained, at least,over an edge portion of a support-plate-3-side surface of the laminate1, and over lateral surface of the laminate 1.

The step of supplying supplies the solvent to the laminate 1, whereinthe laminate 1 is to be treated with the stripping treatment and thesolvent is a solvent to dissolve the adhesive layer 4. The step ofsupplying supplies the non-polar solvent or the highly polar solvent insuch a manner that the non-polar solvent or the highly polar solvent isretained to cover at least the support-plate-3-side surface of thelaminate 1, and the lateral surface of the laminate 1. In case where thestripping device 10 is used to strip the support plate 3 from the wafer2, the solvent supplying chamber 11 is configured to cover the laminate1 with the retaining section 12. With this configuration, the solventsupplied to the retaining section 12 is retained in the retainingsection 12 in such a manner that the solvent covers thesupport-plate-3-side surface of the laminate 1, and the lateral surfaceof the laminate 1, so as to soak the laminate 1 in the solvent.

The adhesive layer 4 is formed from the adhesive compound soluble in thenon-polar solvent or the highly polar solvent. Thus, as the solvent fordissolving the adhesive layer 4, the non-polar solvent or the highlypolar solvent is used in the step of supplying. That is, if the adhesivelayer 4 is formed from the adhesive compound soluble in the non-polarsolvent, the solvent used in the step of supplying is the non-polarsolvent. If the adhesive layer 4 is formed from the adhesive compoundsoluble in the highly polar solvent, the solvent used in the step ofsupplying is the highly polar solvent.

The non-polar solvent may be suitably a non-polar solvent having asolubility parameter (SP value) of 8 or less. It is preferable that thenon-polar solvent is a non-polar solvent having a SP value of 7.4 orless. Examples of such a non-polar solvent having a SP value of 7.4 orless encompass: hydrocarbon-based solvents such as terpene-based solvent(menthane, limonene, pinene, etc.), toluene, xylene, n-hexane,isohexane, cyclohexane, methylcyclohexane, heptane, octance, nanone,etc.; fluorine-based solvents; and the like.

The highly polar solvent may be suitably a conventionally known polarsolvent. It is preferable that the highly polar solvent is a polarsolvent having a SP value of 10 or more. It is more preferable that thehighly polar solvent is a polar solvent having a SP value of 12 or more.Examples of the polar solvent having a SP value of 12 or more encompasswater, methanol, ethanol, isopropyl alcohol, etc.

Solubility of two types of dicing tapes (Tape A (polyolefin resin) andTape B (vinyl chloride resin)) was evaluated with respect to differencein the polarity of the solvents. Each dicing tape was cut into cutsamples of a size of 30 mm×50 mm and a pretreatment weight of eachdicing tape was measured by using an electronic scale. Next, the cutsamples of each dicing tape were respectively soaked for 10 minutes insolvents of a liquid temperature of 23° C. (normal temperature). Thesolvents used in the test were menthane (SP value=7.0), MAK (2 heptane;SP value=9.0), PGMEA (propylene glycol monomethyl ether acetate; SPvalue=9.2), ethanol (SP value=12.9), water (SP value=23.4). After thesoaking in the solvents, the cut samples were dried for 30 minutes byusing an oven that was set at 60° C. Then, a post-treatment weight ofeach cut sample was measured by using the electronic scale.

As a result, a weight change due to dissolution was observed in Tape Afor MAK, PGMEA, and ethanol, while no weight change due to dissolutionwas observed in Tape A for menthane (the lowly polar solvent) and water(highly polar solvent). As to Tape B, a weight change due to dissolutionwas also observed in Tape B for MAK, PGMEA, and ethanol. Especially, itwas observed that Tape B was dissolved quite significantly in MAK andPGMEA, which are polar solvents. Meanwhile, no weight change due todissolution was observed in Tape B for menthane (the lowly polarsolvent) and water (highly polar solvent) as well.

As demonstrated above, the use of the non-polar solvent or the highlypolar solvent for dissolving the adhesive layer 4 in the step ofsupplying prevents the dicing tape 5 from being damaged by the solventthat may touch the dicing tape. The adhesive layer of the dicing tape 5is generally formed from acrylic adhesive agent, and thus is tolerantagainst the non-polar solvent and the highly polar solvent. Therefore,when supplying the solvent so as to cover the support-plate-3-sidesurface and the lateral surface of the laminate 1 with the solvent, itis not necessary to worry about the consequences of the solvent touchingthe solvent touches the dicing tape 5.

In the conventional stripping method, the solvent would damage thedicing tape 5 when the solvent touches the dicing tape 5. To avoid thisproblem, the dissolving the adhesive layer in the conventional strippingmethod should be arranged such that the solvent is supplied to thesupport plate 3 but not to the dicing tape 5 so that the solvent doesnot touch the dicing tape 5. Due to this, it takes a long time to supplythe solvent especially to the edge portion of the support plate 3 inwhich edge portion no hole is provided. As a result, the stripping thesupport plate 3 to the wafer 2 takes a long time.

According to the stripping method of the present embodiment, the solventis supplied, so that the solvent is retained on the support-plate-3-sidesurface and lateral surface of the laminate 1. The solvent permeatesinto the laminate 1 through the though holes of the support plate 3 soas to reach the adhesive layer 4. Further, the solvent reaches theadhesive layer 4 from the lateral side of the laminate 1. Therefore, thesolvent sufficiently permeates to the adhesive layer 4 at the edgeportion at which the support plate 3 has no hole. Thereby, the adhesivelayer 4 can be dissolved efficiently. As a result, it is possible tostrip the support plate 3 from the wafer 2 in a shorter time. In orderto facilitate the solvent to permeate into and to dissolve the adhesivelayer 4, a temperature of the solvent to be supplied may be adjusted asappropriate.

In the stripping method according to the present embodiment, the solventsupplied by the step of supplying is retained on the laminate 1 and thencollected (step of collecting). The step of collecting collects thesolvent from the lateral side of the laminate 1. After the adhesivelayer is dissolved and the solvent is collected by the step ofcollecting, the support plate 3 is stripped from the wafer 2. It may bearranged such that, after stripping the support plate 3 from the wafer2, the non-polar solvent or the high-polar solvent is supplied to thewafer 2 so as to wash the wafer 2 with the non-polar solvent or thehigh-polar solvent. This washing removes the adhesive layer 4 residualon the wafer 2.

One example of the step of supplying and the step of collecting in thestripping method according to the present embodiment is described morespecifically below in reference to (a) to (f) of FIG. 2, which are viewsschematically illustrating the stripping method according to oneembodiment of the first stripping method of the present invention. Thepresent embodiment is explained, referring to an case in which the Oring 13 is used to seal the boundary where the solvent supplying chamber11 and the dicing tape 5 touch each other.

To begin with, as illustrated in (a) of FIG. 2, the solvent supplyingchamber 11 is moved above the laminate 1 and lifted down until the Oring 13 touches the dicing tape 5. The O ring 3 has an outer diametergreater than the outer diameter of the laminate 1. Thus, the solventsupplying chamber 11 is placed over the laminate 1 such that the solventsupplying chamber 11 covers the laminate 1.

Next, as illustrated in (b) of FIG. 2, an air inside the retainingsection 12 formed between the solvent supplying chamber 11 and thedicing tape 5 is sucked out from the discharging openings 15 and 16, soas to lower pressure inside the retaining section 12. Then, asillustrated in (c) of FIG. 2, the solvent is supplied into the retainingsection 12 via the supplying opening 14. The solvent is supplied intothe retaining section 12 via the supplying opening 14, while the solventis sucked via the discharging openings 15 and 16. Thereby, the solventis retained inside the retaining section 12. The solvent into theretaining section 12 is supplied by initial supply of 60 sec. Then, 5 to20-min vibrating treatment is carried out by using a vibrating section27 as described in the later-described second embodiment, for example.

Then, as illustrated in (d) of FIG. 2, lowering the pressure inside theretaining section 12 is stopped and the air is introduced into theretaining section 12 (releasing the pressure to atmosphere). After that,the solvent inside the retaining section 12 is sucked out from thedischarging openings 15 and 16, thereby discharging the solvent out ofthe retaining section 12. As illustrated in (e) of FIG. 2, the air isintroduced into the retaining section 12, thereby bringing the pressurein the retaining section 12 to the atmospheric pressure. Then, asillustrated in (f) in FIG. 2, the solvent supplying chamber 11 is movedup at the end the supplying and the step of collecting. The suppliedsolvent evenly permeates in the adhesive layer 4 of the laminate 1,thereby dissolving the adhesive layer 4 in a short time. As a result,the stripping the support plate 3 from the wafer 2 can be carried out ina shorter time.

Second Embodiment

(Striping Device 20)

Another embodiment of a first stripping method and a first strippingdevice according to the present invention is described below referringto FIGS. 3 and 4. FIGS. 3 and 4 are cross sectional views schematicallyillustrating a stripping device according to the another embodiment(second embodiment) of the first stripping device of the presentinvention. A striping device 20 includes a solvent supplying chamber(retaining means) 21, which forms a retaining section 22 when thesolvent supplying chamber 21 touches the dicing tape 5 adhered on thewafer-2-side surface of the laminate 1. The retaining section 22 isconfigured to retain the solvent between the solvent supplying chamber21 and the dicing tape 5.

The solvent supplying chamber 21 is so configured to contain thelaminate 1 inside thereof, that is, inside the retaining section 22. Theretaining section 22 is constituted by a space formed between, thesolvent supplying chamber 21 and the dicing tape 5 when the solventsupplying chamber 21 touches the dicing tape 5. The solvent supplyingchamber 21 has a supplying opening 24 and the discharging opening 25 onits lateral side. The supplying opening 24 is for supplying the solventinto the retaining section 22, and the supplying opening 25 is fordischarging the solvent out of the retaining section 22. As onealternative, the solvent supplying chamber 21 may be configured suchthat the solvent is supplied into the retaining section 22 via theopening 25 and discharged out of the retaining section 22 via theopening 24. Moreover, as illustrated in FIG. 4, the solvent supplyingchamber 21 may be configured such that a center supplying opening 28 isprovided in the solvent supplying chamber 21 so that the solvent issupplied into the retaining section 22 via the center supplying opening28 and discharged out of the retaining section 22 via the openings 24and 25. The boundary where the solvent supplying chamber 21 and thedicing tape 5 is in contact is sealed with an O ring 23, so that thesolvent supplied to the retaining section 22 will not leak out of theretaining section 22. Moreover, the leakage of the solvent out of theretaining section 22 may be prevented by, instead of using the O ring23, for example, retaining the solvent inside the retaining section 22by surface tension of the solvent between the solvent supplying chamber21 and the dicing tape 5.

The stripping device 20 comprises a vibration transmitting section 26for transmitting vibration to the solvent retained in the retainingsection 22, the vibration being generated by a vibrating section 27provided on the solvent supplying chamber 21. The vibration transmittingsection 26 is located between the vibrating section 27 and the retainingsection 22. The vibration transmitting section 26 may be integrated withthe solvent supplying chamber 21. The vibration transmitting section 26is for transmitting to the solvent retained in the retaining section 22the vibration generated by the vibrating section 27. The vibrationtransmitting section 26 may be constituted by a case-like structurehaving a hollow inside.

The hollow inside the vibration transmitting section 26 is formed in adoughnut-like shape around the center of the solvent supplying chamber21. The vibration transmitting section 26 is configured such that thehollow is located under the vibrating section 27. The hollow of thevibrating section may contain a liquid. The liquid inside the hollow ofthe vibration transmitting section 26 can spread through the liquid thevibration caused by the vibrating section 27. Thus, the vibration causedby the vibrating section 27 can be transmitted to a wider range.

The vibration transmitting section 26 is preferably made from a metal,such as stainless steel, that a good transmission efficiency ofvibration, so that the vibration transmitting section 26 can efficientlytransmit to the solvent inside the retaining section 22 the vibrationcaused by the vibrating section 27. It is preferable that the vibrationtransmitting section 26 has such a dimension in a thickness directionthat an amplitude of the vibration transmitted from the vibratingsection 27 reaches its peak when the vibration reaches a retainingsection-22 side surface of the vibration transmitting section 26. Thisallows efficient transmission of the vibration to the solvent inside theretaining section 22.

The vibrating section 27 may be, for example, a vibrator that vibratesitself for generating vibration, a ultrasonic wave generator forgenerating ultrasonic wave (US), or the like device. The presentinvention is not limited to the present embodiment, in which seven (7)vibrators 27 for generating ultrasonic waves are provided on the solventsupplying chamber 21. At least one vibrating section 27 is provided onthe solvent supplying chamber 21 in order to generate the vibration.Moreover, the vibrating sections 27 is preferably arranged with evenintervals so that the vibration from the vibrating section 27 istransmitted to the whole solvent retained inside the retaining section22.

The solvent supplying chamber 21, the vibrating section 26, and thevibrating section 27 may be configured to move around the laminate 1while the solvent is retained in the retaining section 22. In case of astripping device 20 in which the solvent supplying chamber 21 and thevibration transmitting section 26 are integrated and the vibratingsection 27 is provided on the vibration transmitting section 26, it ispossible to rotate the solvent supplying chamber 21 on the dicing tape 5which the solvent supplying chamber 21 touches via the O ring 23. Inthis way, the solvent supplying chamber 21, the vibration transmittingsection 26, and vibrating section 27 can be rotated together around thelaminate 1.

During the rotation of the solvent supplying chamber 21 about thelaminate 1, the solvent inside the retaining section 22 will not beleaked out because the O ring 23 seals the boundary between the solventsupplying chamber 21 and the dicing tape 5. Here, the O ring 23 ispreferably configured to prevent the leakage of the solvent but not todisturb the rotation of the solvent supplying chamber 21. For example, aTeflon (registered trademark) capsule O ring etc. can be used suitably.Moreover, it may be arranged such that after discharging the solvent outof the retaining section 22 and lifting up the solvent supplying chamber21, the solvent supplying chamber 21 is rotated, and then lowered downuntil the O ring 23 touches the dicing tape 5, so that the solvent issupplied into the retaining section 22 again. The solvent supplyingchamber 21 may be rotated continuously, or in an intermitted manner suchas rotating it by 30 degree and then stop rotating for a while and thenagain rotating it by 30 degree. The rotation of the solvent supplyingchamber 21 may be started after the vibration caused by the vibratingsection 27 is started.

The rotation of the solvent supplying chamber 21, the vibratingtransmitting section 26, and the vibrating section 27 about the laminate1 causes uniform transmission of the vibration from the vibratingsection 27 through the solvent inside the retaining section 22, therebyallowing uniform permeation of the solvent over whole surface of thelaminate 1. This prevents the adhesive layer 4 from being incompletelydissolved. As a result, it is possible to dissolve the adhesive layer 4in a shorter time, thereby making it possible to strip the support plate3 from the wafer 2 in a shorter time.

Moreover, the stripping device 20 is so configured that the supplyingopening 24, the discharging opening 25 and the center supplying opening28 are opened on the lateral side of the solvent supplying chamber 21.This allows providing the vibrating section 27 at the center portion ofthe solvent supplying chamber 21. This allows efficient transmission ofthe vibration caused by the vibrating section 27 to the center portionof the laminate 1. This more efficiently prevents the adhesive layer 4from being incompletely dissolved.

Third Embodiment

A stripping device according one embodiment of a second stripping methodand a second stripping device of the present invention is describedbelow referring to FIG. 5, which a cross sectional view schematicallyillustrating a stripping device 110 according to the present embodimentof the second stripping device of the present invention. The strippingdevice 110 is a device for stripping a support plate 103 from a laminate101 including a wafer (substrate) 102 and the support plate 103 adheredto wafer 102 via an adhesive layer 104. The stripping device 110comprises a solvent supplying chamber (retaining means) 111 forsupplying a solvent to the laminate 101, and for retaining solvent onthe laminate 101, the solvent dissolving the adhesive layer 104. Adicing tape 105 adhered to the laminate 101 is held by a dicing frame106.

In the present embodiment, the solvent supplying chamber 111 forms theretaining section 112 when the solvent supplying chamber 111 reaches,from a support plate 103 side, the dicing tape 105 on a wafer 102 side.The retaining section 112 is configured to retain the solvent therein.The solvent supplying chamber 111 is so configured to contain thelaminate 101 inside thereof, that is, inside the retaining section 112.The retaining section 112 is constituted by a space formed between thesolvent supplying chamber 111 and the dicing tape 105 when the solventsupplying chamber 111 touches the dicing tape 105.

The solvent supplying chamber 111 has, on its lateral side, a centersupplying opening (supplying opening) 119 for supplying the solvent tothe retaining section 112, and discharge openings (collecting openings)114 and 115 for discharging the solvent out of the retaining section115. The solvent supplying chamber 111 may be so configured that thesolvent is supplied via the openings 114 and 115 and the solvent isdischarged via the opening 119. The central supplying opening 119 is athrough hole opened on a center portion of a laminate-101 side of thesolvent supplying chamber 111 and opened on the lateral side of thesolvent supplying chamber 111. The discharging openings 114 and 115 arethrough holes opened on the laminate-101 side of the solvent supplyingchamber 111 and opened on the lateral side of the solvent supplyingchamber 111. The discharging openings 114 and 115 are connected withpressure reducing means (not illustrated) such as a vacuum pump, so thatthe solvent is discharged by applying reduced pressure on the dischargeopenings 114 and 115.

A boundary where the solvent supplying chamber 111 and the dicing tape105 is in contact is sealed with an O ring 113, so that the solventsupplied to the retaining section 112 will not leak out of the retainingsection 112. Moreover, the leakage of the solvent out of the retainingsection 112 may be prevented by, instead of using the O ring 113, forexample, retaining the solvent inside the retaining section 112 bysurface tension of the solvent between the solvent supplying chamber 111and the dicing tape 105. What is required is that the retaining section112 allows the solvent to be inside the retaining section 112 for acertain period of time so that the solvent can permeate into thelaminate 1. For example, the retaining section 112 may be so configuredto make a flow of the solvent in the retaining section 112 from thecenter supplying opening 119 to the discharge openings 114 and 115. Thestripping device 110 includes at least one vibrating section 117 forvibrating at least the solvent supplied in the solvent supplying chamber111, the vibrating section 117 being provided on the solvent supplyingchamber 111. Further, the stripping device 110 includes a vibrationtransmitting section 116 for transmitting to the solvent retained insidethe retaining section 112 the vibration caused by the vibrating section117. The vibration transmitting section 116 is provided between thevibrating section 117 and the retaining section 112. The vibratingtransmitting section 116 may be integrated with the solvent supplyingchamber 111. The vibration transmitting section 116 is configured totransmit to the solvent retained in the retaining section 112 thevibration caused by the vibrating section 117. The vibrationtransmitting section 116 may be constituted by a case-like structurehaving a hollow inside.

The hollow inside the vibration transmitting section 116 is formed in adoughnut-like shape around the center of the solvent supplying chamber111. The vibration transmitting section 116 is configured such that thehollow is located under the vibrating section 117. The hollow of thevibrating section may contain a liquid. The liquid inside the hollow ofthe vibration transmitting section 116 can spread through the liquid thevibration caused by the vibrating section 117. Thus, the vibrationcaused by the vibrating section 117 can be transmitted to a wider range.

The vibration transmitting section 116 is preferably made from a metal,such as stainless steel, that a good transmission efficiency ofvibration, so that the vibration transmitting section 116 canefficiently transmit to the solvent inside the retaining section 112 thevibration caused by the vibrating section 117. It is preferable that thevibration transmitting section 116 has such a dimension in a thicknessdirection that an amplitude of the vibration transmitted from thevibrating section 117 reaches its peak when the vibration reaches aretaining section-112 side surface of the vibration transmitting section116. This allows efficient transmission of the vibration to the solventinside the retaining section 112.

The vibrating section 117 may be, for example, a vibrator that vibratesitself for generating vibration, a ultrasonic wave generator forgenerating ultrasonic wave (US), or the like device. The presentinvention is not limited to the present embodiment, in which seven (7)vibrators 117 for generating ultrasonic wave are provided on the solventsupplying chamber 111. At least one vibrating section 117 is provided onthe solvent supplying chamber 111 in order to generate the vibration.Moreover, the vibrating section 117 is preferably arranged with evenintervals so that the vibration from the vibrating section 117 istransmitted to the whole solvent retained inside the retaining section112.

The stripping device 110 is further provided with a rotating section(moving means) 118 for moving the vibrating section relatively to thelaminate 101. In the present embodiment, the rotating section 118 liftsup and down the solvent supplying chamber 111 above the laminate 101,and then the rotating section 118 with the solvent supplying chamber 111rotates above the laminate 101, thereby causing the vibrating section117 to move relatively to the laminate 101. In case where the vibrationtransmitting section 116 is integrated with the solvent supplyingchamber 111, the rotation of the solvent supplying chamber 111 causesthe vibration transmitting section 116 to rotate about the laminate 101.The vibrating section 117 provided on the vibration transmitting section116 is moved along a periphery of the laminate 101.

By causing the solvent supplying chamber 111 and the vibrationtransmitting section 116 to move along a periphery of the laminate 101in this way, the rotating section 118 causes the vibrating section 117to move relatively to the laminate 101. By this, the vibration from thevibrating section 117 is uniformly transmitted to the solvent inside theretaining section 112, thereby allowing uniform permeation of thesolvent over whole surface of the laminate 101. This prevents theadhesive layer 104 from being incompletely dissolved. As a result, it ispossible to dissolve the adhesive layer 104 in a shorter time, therebymaking it possible to strip the support plate 103 from the wafer 102 ina shorter time. Moreover, the stripping device 110 is so configured thatthe discharging openings 114 and 115 and the center supplying opening119 are opened on the lateral side of the solvent supplying chamber 111.This allows providing the vibrating section 117 at the center portion ofthe solvent supplying chamber 111. This allows efficient transmission ofthe vibration caused by the vibrating section 117 to the center portionof the laminate 101. This more efficiently prevents the adhesive layer104 from being incompletely dissolved.

Here, the solvent supplying chamber 111 is so configured that theretaining section 112 constituted by the solvent supplying chamber 111and the dicing tape 105 has a largest outer diameter larger than anouter diameter of the laminate 101. With this configuration, the solventsupplying chamber 111 can contain the laminate 1 within the retainingsection 112 by covering a support-plate 103-side surface of the laminate101 and lateral surface of the laminate 101. A surface, facing thesupport-plate-103 side of the laminate 101, of the retaining section 112may or may not have a shape corresponding to a shape of the laminate101. That is, the retaining section 112 may or may not have a shapecorresponding to a shape of the laminate 101. The retaining section mayhave any shape provided that the retaining section 112 can contain thelaminate 101 inside thereof. For example, for a laminate 101 having ashape with an orientation flat on its support-plate-103 side, thesolvent supplying chamber 111 may or may not have a shape correspondingto the shape with an orientation flat (e.g. may have a circular shapewithout an orientation flat) on a surface thereof facing the supportplate 103, provided that the solvent supplying chamber 111 can containthe laminate 101 inside thereof.

The rotating section 118 may rotate the solvent supplying chamber 111continuously, or in an intermitted manner such as rotating it by 30degree and then stop rotating for a while and then again rotating it by30 degree. The rotation of the solvent supplying chamber 111 may bestarted after the vibration caused by the vibrating section 117 isstarted, and the rotation of the solvent supplying chamber 111 and thevibration of the vibrating section 117 are carried out concurrently.Moreover, the rotation of the solvent supplying chamber 111 and thevibration of the vibrating section 117 may be carried out alternatively,for example, in such a manner that after the vibration of the vibratingsection 117 is stopped, the rotation of the solvent supplying chamber111 is started, and then after the rotation of the solvent supplyingchamber 111 is stopped, the vibration of the vibrating section 117 isresumed.

During the rotation of the solvent supplying chamber 111 about thelaminate 101, the solvent inside the retaining section 112 will not beleaked out because the O ring 113 seals the boundary between the solventsupplying chamber 111 and the dicing tape 105. Here, the O ring 113 ispreferably configured to prevent the leakage of the solvent but not todisturb the rotation of the solvent supplying chamber 111. For example,a Teflon (registered trademark) capsule O ring etc. can be usedsuitably. Moreover, it may be arranged such that after discharging thesolvent out of the retaining section 112 and lifting up the solventsupplying chamber 111, the solvent supplying chamber 111 is rotated, andthen lowered down until the O ring 113 touches the dicing tape 105, sothat the solvent is supplied into the retaining section 112 again.

Here, the adhesive layer 104 is formed from an adhesive compound solublein a non-polar solvent or a highly polar solvent. Therefore, as thesolvent for dissolving the adhesive layer 104, the solvent supplyingchamber 111 supplies the non-polar solvent or the highly polar solventas via the center supplying opening 119. That is, if the adhesive layer104 is formed from an adhesive compound soluble in a non-polar solvent,the solvent supplying chamber 111 supplies the non-polar solvent as thesolvent for dissolving the adhesive layer 104. Meanwhile, if theadhesive layer 104 is formed from an adhesive compound soluble in ahighly polar solvent, the solvent supplying chamber 111 supplies thehighly polar solvent as the solvent for dissolving the adhesive layer104. Examples of the non-polar solvent and the highly polar solventsuitably usable as the solvent for dissolving the adhesive layer 104will be given later.

Because the stripping device 110 is so arranged that the solvent fordissolving the adhesive layer 104 is a non-polar solvent or a highlypolar solvent, the dicing tape 105 will not be damaged by the solventeven if the solvent touches the dicing tape 105. In general, an adhesivelayer of the dicing tape 105 is formed from an acrylic adhesive agent,whereby the adhesive layer of the dicing tape 105 is tolerant againstnon-polar solvents and highly polar solvents. Therefore, withoutworrying about the consequences of the solvent touching the dicing tape105, it is possible to supply the solvent so as to retain the solventinside the retaining section 112 in which the laminate 101 is contained,and then to cover the support-plate-103-side surface and lateral surfaceof the laminate 101 with the solvent.

Because the dicing tape 105 is damaged if the solvent touches the dicingtape 105, the conventional stripping device requires an O-ring so as tosupply the solvent to the supply plate 103 but not to the dicing tape105 in dissolving the adhesive layer. The O-ring seals the boundarywhere the solvent supplying chamber and the support plate 103 contactwith each other. Because of this, it takes a long time to supply thesolvent to an edge portion at which the support plate 103 has no hole.As a result, the stripping of the support plate 103 from the wafer 102takes a long time.

With the stripping device 110 according to the present embodiment, theretaining section 112 is configured such that the solvent will beretained on the support-plate-103-side surface and lateral surface ofthe laminate 101. As a result, the solvent permeates into the laminate101 via a through hole of the support plate 103 and reaches the adhesivelayer 104. Further, the solvent permeates into the laminate 101 from thelateral side of the laminate 101 so as to reach the adhesive layer 104.Thus, a sufficient amount of the solvent permeates to the adhesive layer104 in the edge portion in which the support plate 103 has no hole. As aresult, the adhesive layer 104 can be efficiently dissolved at the edgeportion as well. This makes it possible to strip the support plate 103from the wafer in a shorter time.

(Laminate 101)

The laminate 101 is so configured that the wafer 102 and the supportplate 103 are adhered with each other via the adhesive layer 104. In thepresent embodiment, the support plate 103 is a holed support plate 103having a plurality of through holes in a thickness direction thereof.The use of the holed support plate 103 makes it possible to supply thesolvent to the adhesive layer 104 via the though holes. The wafer 102 ofthe laminate 101 may or may not have a circular shape and may have anon-circular shape partially having an orientation flat. The supportplate 103 can have any shape that can support the wafer 102. However, itis preferable that the support plate 103 has a shape corresponding tothat of the wafer 102.

(Adhesive Layer 104)

The adhesive layer 104 is formed from an adhesive compound soluble in anon-polar solvent or a highly polar solvent. Therefore, the adhesivelayer 104 is soluble with the non-polar solvent or the highly polarsolvent, thereby allowing stripping the support 103 from the wafer 102.

Examples of the adhesive compound soluble in a non-polar solventencompass hydrocarbon resins. Examples of the hydrocarbon resinencompass, but not limited to, resins having a constituent unit derivedfrom cycloolefin, terpene-based resins, and the like. Moreover, onenon-limiting example of the resins having a constituent unit derivedfrom cycloolefin is a cycloolefin-based polymer (hereinafter may bereferred to as a “resin A”).

The resin A is a resin prepared by polymerizing a monomer componentincluding a cycloolefin-based monomer (a1). More specifically, the resinA may be a open-ring (co)polymer of the monomer component including thecycloolefin-based monomer (a1), a resin prepared by addition(co)polymerization of the monomer component including thecycloolefin-based monomer (a1), and the like polymer.

Examples of the cycloolefin-based monomer (a1) contained in the monomercomponent constituting the resin (A) encompass: two-ring compounds suchas norbornene and norbornadiene; three-ring compounds such asdicyclopentadiene and dihydroxypentadiene; four-ring compounds such astetracyclododecene; five-ring compounds such as cyclopentadiene trimer;seven-ring compounds such as tetracyclopentadiene; these polycycliccompounds substituted with an alkyl (methyl, ethyl, propyl, butyl, etc.)group, with an alkenyl (vinyl etc.) group, with an alkylidene(ethylidene etc.) group, or an aryl (phenyl, tolyl, naphthyl, etc.)group; and the like. Among these, the cycloolefin-based monomer (a1) maybe preferably a norbornene-based monomer being represented by thefollowing general formula (1), and being selected from the groupconsisting of norbornene and tetracyclododecene, which are substitutedor not substituted with an alkyl group.

where R₁ and R₂ are independently a hydrogen or an alkyl group having 1to 5 carbon atoms, and n is 0 or 1. The monomer components from whichthe resin A is produced may include, in addition to thecycloolefin-based monomer (a1), another monomer that is copolymerizablewith the cycloolefin-based monomer (a1). Preferably, the another monomermay be, for example, an alkene monomer (a2) represented by the followinggeneral formula (2). Examples of the alkene monomer (a2) encompassethylene, α-olefin, etc. The alkene monomer (a2) may be straight-chainedor branched.

where R₃ to R₆ are independently a hydrogen or an alkyl group having 1to 5 carbon atoms. It is preferable that 50% or more by mass of themonomer component constituting the resin A is the cycloolefin-basedmonomer (a1). It is more preferable that 60% or more by mass of themonomer component constituting the resin A is the cycloolefin-basedmonomer (a1). When 50% or more by mass of the monomer componentconstituting the resin A is the cycloolefin-based monomer (a1), theadhesive layer 104 has a good adhesive strength under high-temperatureenvironment.

In order to prevent gas generation under high temperature, it ispreferable that the resin (A) is a resin not having a polar group. Oneexample of the resin not having a polar group is a resin prepared bypolymerizing monomer components comprising the cycloolefin-based monomer(a1) represented by Formula (1) and the alkene monomer (a2) representedby Formula (2).

There is no particular limitation as to a polymerization method,polymerization conditions, etc. for the polymerization of the monomercomponent. Thus, the polymerization of the monomer component may becarried out by standard methods known to the art.

Examples of commercially-available resin (A) encompass “TOPAS” (productname, made by Polyplastics Co., Ltd.), “APEL” (product name, made byMitsui Chemicals Inc.), “ZEONOR” and “ZEONEX” (product names, made byZeon Corp.), and “ARTON” (product name, made by JSR corp.), etc.

It is preferable that a glass transition point (Tg) of the resin (A) is60° C. or higher. It is more preferable that the glass transition point(Tg) of the resin (A) is 70° C. or higher. If the glass transition point(Tg) of the resin (A) is 60° C. or higher, it is possible to prevent theadhesive layer from softening that may be caused when the adhesivecomposition is exposed to high-temperature environment.

The terpene-based resin (hereinafter, may be referred to as a “resin(B)” encompass a terpene resin, terpene phenol resin, modified terpeneresin, hydrogenated terpene resin, and hydrogenated terpene phenolresin, and the like. Among these, hydrogenated terpene resin ispreferable.

It is important that the softening point of the resin (B) be in a rangeof 80 to 160° C. If the softening point of the resin (B) is lower than80° C., the adhesive layer will be softened when the adhesivecomposition is exposed to high-temperature environment. Meanwhile, ifthe softening point of the resin (B) is higher than 160° C., thestripping rate for stripping by ungluing the adhesive composition willbe slow.

It is important that the resin (B) have a molecular weight of 300 to3000. If the molecular weight of the resin (B) is less than 300, theadhesive layer will have insufficient heat tolerance, thereby causinggas generation under high-temperature environment. On the other hand, ifthe molecular weight of the resin (B) is greater than 3000, thestripping rate for stripping by ungluing the adhesive composition willbe slow. In the present invention, the molecular weight of the resin (B)is a polystylene-based molecular weight measured by gel permeationchromatography (GPC).

The adhesive compound may include both or one of the resins (A) and (B).If the adhesive compound includes both of the resins (A) and (B), theresin (A) and the resin (B) are in such a ratio that (A):(B)=80:20 to55:45 (by mass). If the resin (A) is contained more than the ratio (inother words, if the resin (B) is contained less than the ratio), thestripping ratio for stripping by ungluing the adhesive composition willbe slow. On the other hand, if the resin (A) is contained less than theratio (in other words, if the resin (B) is contained more than theratio), the adhesive layer will be softened when the adhesivecomposition is exposed to high-temperature environment. The softeningwould cause adhesion failure.

Examples of the adhesive compound soluble in a highly polar solventencompass, but not limited to, collagen peptide, cellulose, polyvinylalcohol (PVA), starch, etc.

The collagen peptide can be generated by hydrolysis of a gelatinprepared by thermally denaturing collagen molecules in such a mannerthat helically-entangled polypeptide chains of the collagen moleculesare partially detangled by thermal denaturing. The collagen moleculesmay be mammalian collagen molecules and fish collagen, preferably. Thecollagen molecules may be commercially available collagen molecules. Thecollagen molecules is preferably such that the collagen peptide preparedfrom the collagen molecule is dissolved into the polar solventpreferably at a dissolving rate of 100 to 300 nm/sec, and especiallypreferably of 200 nm/sec.

The adhesive layer 104 is formed from the adhesive compound soluble inthe non-polar solvent or the highly polar solvent, and may be chosen asappropriate for treatment to which the laminate 101 is to be subjected.For example, if a large amount of water is to be used in a thinningprocess of the wafer 102, it is preferable to use an adhesive layer 104formed from the adhesive compound soluble in the non-polar solvent,because an adhesive compound soluble in the highly polar solvent wouldpossibly be dissolved in the water.

As to a layer thickness of the adhesive layer 104, the adhesive layer104 should have a layer thickness that secures the adhesion between thewafer 102 and the support plate 103, and that provides the adhesivelayer 104 with heat tolerance. The adhesive layer 104 may be formed byapplying the adhesive compound on the wafer 102 or the support plate 103and solidifying the adhesive compound to form a layer of the adhesivecompound. As one alternative, a layer of the adhesive compound formed inadvance by solidifying the adhesive compound may be applied to the wafer102 or the support plate 103, so as to form the adhesive layer 104.

(Stripping Method)

A stripping method according the present embodiment of the secondstripping method of the present invention is a stripping method forstripping the support plate 103 from the laminate 101 including thewafer 102 and the support plate 103 adhered to the wafer 102 via theadhesive layer 104, the method comprising: the step of supplying thesolvent in such a manner that the solvent for dissolving the adhesivelayer 104 is retained on the laminate 101; the step of vibrating, byusing the vibrating section 117, at least the solvent retained on thelaminate 101; and the step of moving the vibrating section 117relatively to the laminate 101.

(Step of Supplying)

In the step of supplying, the solvent for dissolving the adhesive layer104 is supplied to the laminate 101 to be treated with the strippingtreatment, and the solvent is retained on the laminate 101. The solventis preferably supplied to the laminate 101 in such a manner that thesolvent covers the support-plate-103-side surface and lateral surface ofthe laminate 101 at least. In case where the stripping device 110 isused to strip the support plate 103 from the wafer 102, the solventsupplying chamber 111 is configured so that the retaining section 112covers the laminate 101. With this configuration, the solvent suppliedinto the retaining section 112 is retained inside the retaining section112, so that the support-plate-103-side surface and lateral surface ofthe laminate 101 are covered with the solvent, thereby soaking thelaminate 101 in the solvent.

Here, the adhesive layer 104 is formed from the adhesive compoundsoluble in the non-polar solvent or the highly polar solvent. Thus, asthe solvent for dissolving the adhesive layer 104, the non-polar solventor the highly polar solvent is used in the step of supplying. That is,if the adhesive layer 104 is formed from the adhesive compound solublein the non-polar solvent, the solvent used in the step of supplying isthe non-polar solvent. If the adhesive layer 104 is formed from theadhesive compound soluble in the highly polar solvent, the solvent usedin the step of supplying is the highly polar solvent.

The non-polar solvent may be suitably a non-polar solvent having asolubility parameter (SP value) of 8 or less. It is preferable that thenon-polar solvent is a non-polar solvent having a SP value of 7.4 orless. Examples of such a non-polar solvent having a SP value of 7.4 orless encompass: hydrocarbon-based solvents such as terpene-based solvent(methane, limonene, pinene, etc.), toluene, xylene, n-hexane, isohexane,cyclohexane, methylcyclohexane, heptane, octance, nanone, etc.;fluorine-based solvents; and the like.

The highly polar solvent may be suitably a conventionally known polarsolvent. It is preferable that the highly polar solvent is a polarsolvent having a SP value of 10 or more. It is more preferable that thehighly polar solvent is a polar solvent having a SP value of 12 or more.Examples of the polar solvent having a SP value of 12 or more encompasswater, methanol, ethanol, isopropyl alcohol, etc.

Solubility of two types of dicing tapes (Tape A (polyolefin resin) andTape B (vinyl chloride resin)) was evaluated with respect to differencein the polarity of the solvents. Each dicing tape was cut into cutsamples of a size of 30 mm×50 mm and a pretreatment weight of eachdicing tape was measured by using an electronic scale. Next, the cutsamples of each dicing tape were respectively soaked for 10 minutes insolvents of a liquid temperature of 23° C. (normal temperature). Thesolvents used in the test were menthane (SP value=7.0), MAK (2 heptane;SP value=9.0), PGMEA (propylene glycol monomethyl ether acetate; SPvalue=9.2), ethanol (SP value=12.9), water (SP value=23.4). After thesoaking in the solvents, the cut samples were dried for 30 minutes byusing an oven that was set at 60° C. Then, a post-treatment weight ofeach cut sample was measured by using the electronic scale.

As a result, a weight change due to dissolution was observed in Tape Afor MAK, PGMEA, and ethanol, while no weight change due to dissolutionwas observed in Tape A for menthane (the lowly polar solvent) and water(highly polar solvent). As to Tape B, a weight change due to dissolutionwas also observed in Tape B for MAK, PGMEA, and ethanol. Especially, itwas observed that Tape B was dissolved quite significantly in MAK andPGMEA, which are polar solvents. Meanwhile, no weight change due todissolution was observed in Tape B for menthane (the lowly polarsolvent) and water (highly polar solvent) as well.

As demonstrated above, the use of the non-polar solvent or the highlypolar solvent for dissolving the adhesive layer 104 in the step ofsupplying prevents the dicing tape 105 from being damaged by the solventthat may touch the dicing tape. The adhesive layer of the dicing tape105 is generally formed from acrylic adhesive agent, and thus istolerant against the non-polar solvent and the highly polar solvent.Therefore, when supplying the solvent so as to cover the support-platesurface and the lateral surface of the laminate 101 with the solvent, itis not necessary to worry about the consequences of the solvent touchingthe solvent touches the dicing tape 105.

In the conventional stripping method, the solvent would damage thedicing tape 105 when the solvent touches the dicing tape 105. To avoidthis problem, the dissolving the adhesive layer in the conventionalstripping method should be arranged such that the solvent is supplied tothe support plate 103 but not to the dicing tape 105 so that the solventdoes not touch the dicing tape 105. Due to this, it takes a long time tosupply the solvent especially to the edge portion of the support plate103 in which edge portion no hole is provided. As a result, thestripping the support plate 103 to the wafer 102 takes a long time.

According to the stripping method of the present embodiment, the solventis supplied, so that the solvent is retained on thesupport-plate-103-side surface and lateral surface of the laminate 101.The solvent permeates into the laminate 101 through the though holes ofthe support plate 103 so as to reach the adhesive layer 104. Further,the solvent reaches the adhesive layer 104 from the lateral side of thelaminate 101. Therefore, the solvent sufficiently permeates to theadhesive layer 104 at the edge portion at which the support plate 103has no hole. Thereby, the adhesive layer 104 can be dissolvedefficiently. As a result, it is possible to strip the support plate 103from the wafer 102 in a shorter time. In order to facilitate the solventto permeate into and to dissolve the adhesive layer 104, a temperatureof the solvent to be supplied may be adjusted as appropriate.

(Step of Vibrating)

In the step of vibrating, at least the solvent supplied and retained onthe laminate 101 in the step of supplying is vibrated by the vibratingsection 117. In case where the stripping device 110 is used to strip thesupport plate 103 from wafer 102, the vibration caused by the vibratingsection 117 can be transferred to the solvent by providing the vibratingsection 117 on the vibration transferring section 116 of the solventsupplying chamber 111, the solvent being retained on the laminate 101and the solvent supplying chamber 111 covering the laminate 101 with theretaining section 112. The step of vibrating may be carried out afterthe step of supplying supplies the solvent to the laminate 101, orconcurrently while the step of supplying supplies the solvent to thelaminate 101.

(Step of Moving)

In the step of moving, the vibrating section 117 is moved relatively tothe laminate 101. It is preferable that the step of moving moves thevibrating section 117 along a periphery of the laminate 101. In casewhere the stripping device 110 is used to strip the support plate 103from the wafer 102, the rotation of the solvent supplying chamber 111along the periphery of the laminate 101 can move the vibrating section117 on the vibration transmitting section 116 of the solvent supplyingchamber 111 relatively to the laminate 101.

The step of moving may be carried out concurrently with the step ofvibrating in which the vibrating section 117 performs the vibration. Asone alternative, the step of moving and the step of vibrating may becarried out alternatively, for example, in such a manner that, after thestep of vibrating is stopped, the step of moving is carried out, andthen after the step of moving, the step of vibrating is resumed.Moreover, it may be so arranged that the step of moving is carried outafter the solvent is supplied by the step of supplying, the vibration iscaused by the step of vibrating, and then the solvent thus supplied iscollected. In this case, after the solvent thus supplied is collected,the solvent supplying chamber 111 is lifted up and rotated by therotating section 118, and then the solvent supplying chamber 111 islifted down until the solvent supplying chamber 111 touches the dicingtape 105. Then, the step of supplying supplies to solvent to theretaining section 112 again and the step of vibrating is resumed.

(Step of Collecting and Step of Washing)

In the stripping method according to the present embodiment, the solventsupplied in the step of supplying is collected (step of collecting)after the solvent is retained on the laminate 101. In the step ofcollecting, the solvent is collected from the lateral side of thelaminate 101. After the solvent is collected in the step of collecting,and the adhesive layer 104 is dissolved, the support plate 103 isstripped from the wafer 102. It may be arranged such that after thesupport plate 103 is stripped from the wafer 102, the non-polar solventor the highly polar solvent is supplied on the wafer 102 so as to washthe wafer 102 with the non-polar solvent or the highly polar solvent(step of washing). The washing removes the adhesive layer 104 residualon the wafer 102.

One specific example of the stripping method according to the presentembodiment is explained below referring to (a) to (f) of FIG. 6, whichare views schematically illustrating the stripping method according tothe present embodiment of the second stripping method of the presentinvention. The present embodiment is explained based on an example inwhich the boundary between the solvent supplying chamber 111 and thedicing tape 105 are sealed with the O ring 113.

To begin with, as illustrated in (a) of FIG. 6, the solvent supplyingchamber 111 is moved above the laminate 101 and lowered until the O ring113 touches the dicing tape 105. The O ring 113 has an outer diametergreater than the outer diameter of the laminate 101. Thus, the solventsupplying chamber 111 is placed over the laminate 101 such that thesolvent supplying chamber 111 covers the laminate 101.

Next, as illustrated in (b) of FIG. 6, an air inside the retainingsection formed between the solvent supplying chamber 111 and the dicingtape 105 is sucked out from the discharging openings 114 and 115, so asto lower pressure inside the retaining section 112. Then, as illustratedin (c) of FIG. 6, the solvent is supplied into the retaining section 112via the center supplying opening 119. The solvent is supplied into theretaining section 112 via the center supplying opening 119, while thesolvent is sucked via the discharging openings 114 and 115. Thereby, thesolvent is retained inside the retaining section 112. In this example,the solvent into the retaining section 112 is supplied by initial supplyof 60 sec. Then, 5 to 20-min vibrating treatment is carried out by usinga vibrating section 117.

As illustrated in (d) of FIG. 6, the solvent inside the retainingsection 112 is sucked out via the discharging openings 114 and 115, soas to discharge the solvent out of the retaining section 112. Then, asillustrated in (e) of FIG. 6, the lowering the pressure inside theretaining section 112 is stopped and an air is introduced into theretaining section 112 via the central supplying opening 119 (releasingthe pressure to atmosphere), thereby bringing the pressure in theretaining section 112 to the atmospheric pressure. Then, as illustratedin (f) of FIG. 6, the solvent supplying chamber 111 is lifted up androtated about the laminate 101. It may be arranged such that theprocesses illustrated in (a) to (f) of FIG. 6 are repeated apredetermined number of times. Through these processes, the solventsupplied on the laminate 101 uniformly permeates into the adhesive layer104. Therefore, the adhesive layer 104 can be dissolved in a shortertime. As a result, it becomes possible to strip the support plate 103from the wafer 102 in a shorter time.

Fourth Embodiment

(Stripping Device 120)

A stripping device according to another embodiment of the secondstripping method and second stripping device of the present invention isdescribed below referring to FIG. 7, which is a cross sectional viewschematically illustrating a striping device 120 according to theanother embodiment of the second stripping device of the presentinvention. As illustrated in FIG. 7, the stripping device 120 includes asolvent supplying chamber 121. The solvent supplying chamber 121 forms aretaining section 122 between the solvent supplying chamber 121 and thedicing tape 105 when the solvent supplying chamber 121 touches thedicing tape 105. The retaining section 122 is configured to retain thesolvent therein.

The solvent supplying chamber 121 is configured such that the solventsupplying chamber 121 contains the laminate 101 inside thereof, that is,within the retaining section 122. The retaining section 122 isconstituted by a space formed between the solvent supplying chamber 121and the dicing tape 105 when the solvent supplying chamber 121 touchesthe dicing tape 105. The solvent supplying chamber 121 has, at a centerportion thereof, a supplying opening 123 for supplying the solvent intothe retaining section 122. Moreover, the solvent supplying chamber 121has discharging openings 124 and 125, which are through holes opened ona contact surface of the solvent supplying chamber 121 and opened on alateral side of the solvent supplying chamber 121. The contact surfaceof the solvent supplying chamber 121 is a surface with which the solventsupplying chamber 121 touches the dicing tape 105. A surface tension ofthe solvent at the boundary between the solvent supplying chamber 121and the dicing tape 105 at which boundary they touch each other causesthe solvent to be held inside the retaining section 122, therebypreventing the solvent from leaking out of the retaining section 122.

The stripping device 120 includes a vibration transmitting section 126for transmitting vibration to the solvent retained inside the retainingsection 122, the vibration being caused by a vibrating section 127provided on the solvent supplying chamber 121. The vibrationtransmitting section 126 and the vibrating section 127 are similar tothe vibration transmitting section 116 and the vibrating section 117 inthe third embodiment. Therefore, their explanation is omitted here.

In the stripping device 120, the laminate 101 is held on a holdingstation of the rotating section 128 in such a way that the surface ofthe laminate 101 which surface is adhered with the dicing tape 105touches the holding station of the rotating section 128. The rotatingsection 128 rotates the dicing tape 105 with the dicing tape adhered tothe laminate 101 fixed by chucking mechanism (not illustrated). By this,the laminate 10 adhered with the dicing tape 105 is moved relatively tothe vibrating section 127 on the vibration transmitting section 126 ofthe solvent supplying chamber 121. This causes uniform transmission ofthe vibration from the vibrating section 127 through the solvent insidethe retaining section 22, whereby the solvent supplied on the laminate101 uniformly permeates into the adhesive layer 104. Therefore, theadhesive layer 104 can be dissolved in a shorter time. As a result, itbecomes possible to strip the support plate 103 from the wafer 102 in ashorter time.

The surface tension at the boundary where the supplying chamber 121 andthe dicing tape 105 contact with each other keeps the solvent within theretaining section 122. The surface tension prevents the solvent fromleaking out of the retaining section 122 even during the rotation of thedicing tape 105 by the rotating section 128. Thus, the stripping device120 can carry out the supply of the solvent to the retaining section122, the vibration of the vibrating section 127, and the rotation of thedicing tape by the rotating section 128, concurrently.

The invention being thus described, it will be obvious that the same maybe varied in many ways. Such variations are not to be regarded as adeparture from the spirit and scope of the invention, and all suchmodifications as would be obvious to one skilled in the art are intendedto be included within the scope of the following claims.

INDUSTRIAL APPLICABILITY

According to a stripping method and a stripping device of the presentinvention, it is possible to strip a support plate from a wafer in ashorter time. For example, the stripping method and the stripping deviceof the present invention are suitably applicable to manufacture of asemiconductor device to be miniaturized.

REFERENCE SIGNS LIST

-   1, 101: Laminate-   2, 102: Wafer (Substrate)-   3, 103: Support Plate-   4, 104: Adhesive Layer-   5, 105: Dicing Tape-   6, 106: Dicing Frame-   10, 110: Stripping Device-   11, 111: Solvent Supplying Chamber (Retaining Means)-   12, 112: Retaining Section-   13, 113: O ring-   14: Supplying Opening-   15: Discharge Opening-   16: Discharge Opening-   114: Discharge Opening (Collecting Opening)-   115: Discharge Opening (Collecting Opening)-   116: Vibration Transmitting Section-   117: Vibrating Section-   118: Rotating Section (Moving Means)-   119: Central Supplying Opening (Supplying Opening)

1. A stripping method for stripping a support plate from a laminateincluding a substrate and the support plate adhered to the substrate viaan adhesive layer, the stripping method comprising: supplying on thelaminate a solvent for dissolving the adhesive layer, so that thesolvent is retained on the laminate; vibrating, by a vibrating section,at least the solvent retained on the laminate; transmitting, by avibration transmitting section provided between the retaining means andthe at least one vibrating section, the vibration from the at least onevibrating section to the solvent retained on the laminate; andcollecting the solvent retained on the laminate, wherein the vibrationtransmitting section has a supplying opening and a collecting opening,the supplying supplies the solvent to the retaining means via thesupplying opening, and the collecting collects the solvent on thelaminate via the collecting opening.
 2. The stripping method as setforth in claim 1, further comprising moving the vibrating sectionrelative to the laminate, wherein the vibrating and the moving arecarried out concurrently.
 3. The stripping method as set forth in claim1, further comprising moving the vibrating section relative to thelaminate, wherein the vibrating and the moving are carried outalternatively.